Buffalo Automation currently has the following controllers running on the Process Control Framework:
- Photolithography Dose
- Weighted moving average
- Feed back of post-develop (DI) CD
- Photolithography Overlay
- Weighted moving average
- Feedback of overlay components
- Block Etch
- Exponentially weighted moving average
- Feed back post-etch thickness
- Feed forward pre-etch thickness
- Local Interconnect Etch
- Uses test wafer etch rate from chamber qualification
- Feed forward pre-etch thickness
- Compensates for pattern density
- Contact/Via Etch
- Uses test wafer etch rate from chamber qualification
- Feed forward pre-etch thickness
- Poly Etch
- Exponentially weighted moving average of previous lots
- Feed back previous lot post-develop (DI) and post-etch (FI) CD’s
- Feed forward current lot post-develop (DI) CD
- Poly Gate Diffusion
- Control of oxidation time and zone temperatures
- Feed back of thickness at each furnace zone
Note that the above list does not include customer developed controllers.
With the use of an APC Framework, controllers can be developed quickly with little or no need for additional functionality in the framework. Custom functionality can be added to the framework to allow for protection of customer intellectual property.
For facilities looking to outsource implementation of an in-house controller or develop a new model, Buffalo Automation can supply implementation services to get your controller ready for production. Typical contracts include requirements, design, implementation, installation, test and startup phases. Please contact sales for more information.